Overview
The Process Engineer – Flex Attach involves assisting senior engineers in designing, developing and documenting processes for the manufacture of print head products at a conceptual level through to manufacturing implementation and to advance process technologies in the area of flex attach thereby enabling creative and innovative product design solutions which can be up-scaled to high volume manufacturing.

Main Activities/Tasks:

• Participate in the development and implementation of process concepts for existing and future products. Tasks include:
- Brainstorming product & process ideas across all teams.
- Work with the equipment vendors to develop equipment requirement specifications.
- Specify or select materials and verify that they meet requirement specifications.
- Establish and validate process parameters.
- Communicate within the group and SBR as necessary during product development.
• Produce or contribute in generating information for various groups to take product concepts through to manufacturing realization. Documents required are:
- Materials specifications.
- Product and process requirement specifications.
- Process instructions.
- Equipment requirement specifications.
- Formulation of test plans
- Generate test and analysis reports.
- Liaison with internal staff and external suppliers as required.
- Managing and achieving deadlines within projects.
• Contribute to the design, assembly and test of development rigs, models & prototypes as required.
• Assist in collaborative projects incorporating product design, process development, manufacturing automation and software control to achieve cost effective innovative solutions.
• Participate in developing technical expertise within the company and teams in areas of materials selection, precision alignment and assembly, bonding, soldering and advance the process capability to achieve the strategic aims of the company.
• Contribute to the evaluation of existing technologies and determine paths forward to improve yields, lower costs and raise output.

Essential Experience/Requirements:

The applicant should be degree qualified in engineering or have equivalent relevant experience, having exposure to silicon chip packaging and chip electrical interconnection techniques, exposure to precision dispensing systems, knowledge of adhesives and bonding systems, proven understanding of microelectronic packaging materials, their properties and applications, exposure to design document control

If you are interested in this Job please send an email to jobs@silverbrookresearch.com and provide the information listed below.

» Job Title

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» Cover Letter - Size limit 2MB - PDF, DOC, RTF, TXT format files only

» Resume - Size limit 2MB - PDF, DOC, RTF, TXT format files only

We regret to advise that only shortlisted candidates will be contacted.